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Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1

Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1

✅HIGH PRECISION-MIJING BGA Stencil is a High Precision BGA Reballing Template
✅COMPATABILITY-Compatible with MSM 8992A/8976A/8996A, Qualcom CPU.

✅HEAT-Can be used with direct heat.

✅REQUIRED TOOL-This is a required tool for reballing ic's.

✅SMALL AND STRONG-This product is small and strong.

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Regular price £4.99
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SKU: mijingsten-qu1

Description:

MIJING BGA Stencil is a High Precision BGA Reballing Template for MSM 8992A/8976A/8996A, Qualcom CPU and can be used with direct heat. This is a required tool for reballing ic's onMSM 8992A/8976A/8996A, Qualcom CPU.



Product Information:
SKU: mijingsten-qu1

Material: Metal
Weight: 0.03kg
Colour: Silver
Dimensions: L: n/a W: n/a H: n/a

Ships From: United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture: China
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