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Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3
Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3
✅HIGH PRECISION-MIJING BGA Stencil is a High Precision BGA Reballing Template
✅COMPATABILITY-Compatible with iPhone 7, 7 Plus & A10 CPU
✅HEAT-Can be used with direct heat.
✅REQUIRED TOOL-This is a required tool for reballing ic's.
✅SMALL AND STRONG-This product is small and strong.
7 in stock
Regular price
£5.99
Regular price
Sale price
£5.99
Unit price
/
per
PRICE INCLUDES 20% VAT
SKU: mijingsten-iph3
Description:
MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone 7, 7 Plus & A10 CPU and can be used with direct heat. This is a required tool for reballing ic's on iPhone 7, 7 Plus & A10 CPU logic boards.
Product Information:
SKU: mijingsten-iph3
Material: Metal
Weight: 0.03kg
Colour: Silver
Dimensions: L: n/a W: n/a H: n/a
Ships From: United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture: China