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Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3

Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3

✅HIGH PRECISION-MIJING BGA Stencil is a High Precision BGA Reballing Template
✅COMPATABILITY-Compatible with iPhone 7, 7 Plus & A10 CPU
✅HEAT-Can be used with direct heat.

✅REQUIRED TOOL-This is a required tool for reballing ic's.

✅SMALL AND STRONG-This product is small and strong.

 

7 in stock

Regular price £5.99
Regular price Sale price £5.99
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PRICE INCLUDES 20% VAT


SKU: mijingsten-iph3

Description:

MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone 7, 7 Plus & A10 CPU and can be used with direct heat. This is a required tool for reballing ic's on iPhone 7, 7 Plus & A10 CPU logic boards.



Product Information:
SKU: mijingsten-iph3

Material: Metal
Weight: 0.03kg
Colour: Silver
Dimensions: L: n/a W: n/a H: n/a

Ships From: United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture: China
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