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Reballing Stencil For iPhone 13 Series Mijing T3D A15 3D NAND BGA IC Chip
Reballing Stencil For iPhone 13 Series Mijing T3D A15 3D NAND BGA IC Chip
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job.
Ultra-thin 0.
12mm design with better application of solder paste tinning, continuous bending, and very tough.
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only.
Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
Low stock: 3 left
PRICE INCLUDES 20% VAT
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SKU: mjstenip133d
Description:
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough.
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
Product Information:
SKU: mjstenip133d
Material: Aluminium
Weight: 0.03kg
Colour: Sivler
Dimensions: L: 15cm W: 10cm H: 0.1cm
Ships From: United Kingdom
Country / Region of Manufacture: China
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