Reballing Stencil For iPhone 13 Pro Max Mini Relife RL044 A15

QUALITY - This Relife reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough. 

USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.

COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.

MODEL - Relife RL-044

MATERIAL - CNC laser Cut Steel

Product Features

Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.

Precise positioning: Combined with Mechanic-i soldering XP special solder paste, the effect is higher, the tin is full, no solder.

Ultra-thin 0.12mm design: better fitting of tinning, continuous bending, full of toughness.

Between the squares, the strength more durable and not deformed.

High temperature material, not easy to deform no drumpack, no virtual welding.

Maintenance master plant tin steel mesh technical standards for more than the usual laser process.

Product Specification

Item name: Relife RL-044 Reballing Stencil For iPhone 13/Pro/Max/Mini A15

Brand: Relife

Model: RL-044
Thickness: 0.12MM