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Reballing Stencil For iPhone A9 CPU 3D BGA IC
Reballing Stencil For iPhone A9 CPU 3D BGA IC
This 3D planting stencil is thicker than ordinary stencils in the market.
The square holes design makes it easier to take out the formed solder balls.
High success rate of planting tin, the solder balls can be formed once after you are proficient.
Less tendency of deformation makes its using life be longer.
Stepped groove design enables this stencil to align with tinning position of IC rapidly.
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SKU:
SKU:3dbga-a9
Description:
3D BGA IC Reballing Stencil For A9
This 3D planting stencil is thicker than ordinary stencils in the market.
Less tendency of deformation makes its using life be longer.
Stepped groove design enables this stencil to align with tinning position of IC rapidly.
The square holes design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter you are a new or expert.
High success rate of planting tin, the solder balls can be formed once after you are proficient.
Product Information:
Material: Metal
Weight: 0.02kg
Colour: Silver
Dimensions: L: n/a W: n/a H: n/a
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