Reballing Stencil For iPhone A9 CPU 3D BGA IC

3D BGA IC Reballing Stencil For A9

This 3D planting stencil is thicker than ordinary stencils in the market.

Less tendency of deformation makes its using life be longer.

Stepped groove design enables this stencil to align with tinning position of IC rapidly.

The square holes design makes it easier to take out the formed solder balls.

This 3D stencil is easy to use no matter you are a new or expert.

High success rate of planting tin, the solder balls can be formed once after you are proficient.