MIJING BGA Stencil is a High Precision BGA Reballing Template for Huawei P20/20Pro, Mate10/10Pro/RS, 10/V10, Kirin970, HI3670 CPU and can be used with direct heat. This is a required tool for reballing ic's on Huawei P20/20Pro, Mate10/10Pro/RS, 10/V10, Kirin970, HI3670 CPU.
