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Reballing Stencil For iPhone 16 A18/A18Pro IC CPU 0.12mm Relife RL-044 IPZ15
Reballing Stencil For iPhone 16 A18/A18Pro IC CPU 0.12mm Relife RL-044 IPZ15
0.
12mm Thickness: The stencil features a 0.
12mm thickness, ensuring precise alignment during the reballing process.
Easy to Use: The stencil is easy to use, even for beginners, allowing for efficient and accurate reballing.
Professional Repair: Ideal for professional repair technicians and individuals looking to perform high-quality repairs.
17 in stock
PRICE INCLUDES 20% VAT
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Precision Reballing for iPhone 16 A18/A18Pro
This Reballing Stencil, meticulously crafted by Relife, is specifically designed for the iPhone 16 A18/A18Pro IC CPU. Its advanced 0.12mm thickness ensures accurate placement of solder balls, making it a crucial tool for professional repair technicians.
Key Features:
Model: RL-044 IPZ15
Compatibility: iPhone 16 A18/A18Pro IC CPU
Thickness: 0.12mm
Material: High-quality stainless steel
Why Choose Relife:
Exceptional Accuracy: The 0.12mm thickness ensures the stencil aligns perfectly with the IC CPU pads, guaranteeing accurate solder ball placement.
Durable Construction: Made from robust stainless steel, the stencil is built to withstand repeated use, ensuring longevity and reliability.
Professional Quality: Relife is a trusted name in the electronics repair industry, known for producing high-quality tools like this reballing stencil.
Streamlined Reballing: This stencil simplifies the reballing process, allowing for efficient and precise application of solder balls.
Essential for Repairs: It's a crucial tool for professionals who repair iPhones, enabling them to perform intricate IC CPU reballing procedures with confidence.
Package Content:
1 x Reballing Stencil For For iPhone 16 A18/A18Pro IC CPU T:0.12mm Relife RL-044 IPZ15
Product Information:
SKU: rl044-ipz15
Material: Steel
Weight: 0.03kg
Colour: Silver
Dimensions: L: 8cm W: 5cm H: 0.1cm
HS Code: n/a
Ships From: United Kingdom
Country / Region of Manufacture: China
