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This 3D planting stencil is thicker than ordinary stencils in the market.
The square holes design makes it easier to take out the formed solder balls.
High success rate of planting tin, the solder balls can be formed once after you are proficient.
Less tendency of deformation makes its using life be longer.
Used for reballing the bottom logic board of an iPhone X ready to be re-soldered to the top board on iPhone X
Low stock: 3 left
Regular price
£23.99
Regular price
Sale price
£23.99
Unit price
/
per
PRICE INCLUDES 20% VAT
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SKU:
3dipxstencil
Description:
Used for reballing the bottom logic board of an iPhone X ready to be re-soldered to the top board on iPhone X
3D stecils allow precise positioning of the logic board prior to reballing
also supplied with high temperature resistant fixing station to allow a perfect finish when doing this work.
Product Information:
SKU:
3dipxstencil
Material:
Metal
Weight:
0.02kg
Colour:
Silver
Dimensions:
L: n/a W: n/a H: n/a
Ships From:
United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture:
China
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