Introducing our cutting-edge Chip Holder Module, a game-changer in the realm of integrated circuit maintenance and repair. With a suite of features designed to streamline your workflow and enhance precision, this module is engineered to meet the demands of professionals across diverse industries.
Key Features:
Universal Compatibility: Compatible with 99% of ICs available in the market, ensuring versatility and broad applicability.
Efficient Automatic Adjustment: Equipped with a fast automatic adjust button and powerful magnet, facilitating swift and accurate positioning for enhanced efficiency.
Precision Engineering: Boasts high precision in chip adjustment, aided by an internal magnet that automatically fixes the chip, enabling rapid and convenient operation.
Durable Construction: Crafted from imported alloy steel using advanced technology, ensuring durability, resistance to dirt, and easy maintenance.
Flexible Stencil: Features a rigid yet flexible stencil, maintaining its shape even after deformation or bending, ensuring consistent performance over time.
No-Burr Precision: Delivers high precision with no burrs, guaranteeing uniform mesh size and preventing chips from getting stuck during operation.
Maximum Versatility: Supports a wide range of chip sizes, from a minimum of 1.6mm x 1.6mm to a maximum of 45mm x 45mm, accommodating various applications.
Functionality Highlights:
Built-in Adjustment Mechanisms: Incorporates a built-in knob for lateral movement adjustment, a large turntable for longitudinal movement adjustment, and four lifting screws for stencil positioning module height adjustment, ensuring optimal performance across different tasks.
User-Friendly Design: Features scales and direction marks on all four corners for precise adjustment, along with a turn screw to lock the turntable securely in place, preventing accidental displacement of chips.
Convenient Tin Ball Pouring: Includes a unique hidden tin ball pouring slot design, allowing for quick and hassle-free removal of excess tin balls, enhancing operational efficiency.
Stencil Specifications:
IP A8-A17 CPU Stencil: Compatible with a wide range of CPUs, including iPhone models from 6 to 15 series, with a net thickness of 0.12mm and square holes with rounded corners.
EMMC UFS Stencil: Designed for EMMC EMCP UFS BGA of various sizes, featuring a net thickness of 0.12mm and square holes with rounded corners.
Universal BGA Stencil: Offers versatility with multiple spacing options, suitable for diverse applications, with a net thickness of 0.12mm and square holes with rounded corners.
0.5-1.5MM Universal Stencil: Specifically designed for solder balls, featuring various sizes and spacings to accommodate different requirements, with a net thickness of 0.2mm and circular holes.
