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BGA Reballing For iPhone X Middle Layer Board Frame
BGA Reballing For iPhone X Middle Layer Board Frame
Compatible with iPhone X Only (only for iPhone X).
Used to help you fix the motherboard tightly.
Upper Lower Layers board frame gives best solution for professional phone repair.
High temp resistant and anti-static, Ideal for phone motherboard soldering repair.
Perfect for repairing iPhone X Layered Logic Board
Low stock: 3 left
Ex Vat:
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SKU:
SKU:ipx-midframe
Description:
Compatible with iPhone X Only (only for iPhone X).
Used to help you fix the motherboard tightly.
Upper Lower Layers board frame gives best solution for professional phone repair.
High temp resistant and anti-static, Ideal for phone motherboard soldering repair.
Perfect for repairing iPhone X Layered Logic Board
Specification:
Material: Heat resistant resin
Size: Approx. 5 x 2.5 x 0.3 cm
Package Contents:
1 x For iPhone X - BGA Reballing Middle Layer Board Frame
Product Information:
Material: Heat Resistant Resin
Weight: 0.01kg, 0.01kg, 0.01kg
Colour: Gold
Dimensions: L: 5cm W: 2.5cm H: 0.3cm
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