BGA Reballing For iPhone X Middle Layer Board Frame

Compatible with iPhone X Only (only for iPhone X).

Used to help you fix the motherboard tightly.

Upper Lower Layers board frame gives best solution for professional phone repair.

High temp resistant and anti-static, Ideal for phone motherboard soldering repair.

Perfect for repairing iPhone X Layered Logic Board

Specification:

Material: Heat resistant resin

Size: Approx. 5 x 2.5 x 0.3 cm

Package Contents:

1 x For iPhone X - BGA Reballing Middle Layer Board Frame