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BGA Solder Paste
BGA Solder Paste
Reduced Manufacturing Costs: Enables automation and high-volume production, saving time and resources.
Improved Product Quality: Precise paste dispensing and excellent solderability lead to consistent and high-quality assembly.
Versatile Applications: Suitable for a wide range of BGA sizes and pitches, accommodating the needs of diverse electronic devices.
BGA solder paste is the cornerstone of high-performance electronics assembly, enabling the creation of sophisticated and reliable devices essential for modern technology.
60 in stock
Ex Vat:
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SKU:
SKU:wk-030g
Description:
BGA solder paste is a specialized material crucial for the surface mount assembly of complex electronic components like microprocessors and memory chips.
Features:
Ideal for EMMC chip replacements.
Suitable for reworking and repairing various circuit boards.
Provides high joint intensity for durable connections.
Features excellent immersion properties for smooth application.
Offers good insulating capabilities to safeguard electronic components.
Designed for use with cell phone PCBs and surface-mounted devices (SMD) such as BGA and PGA.
Aids in circuit board repairs and protects sensitive electronic components.
An essential material for mobile phone mainboard repairs.
Available in a convenient 35g size.
Package Content:
1 x BGA Solder Paste
Product Information:
Material: Solder Paste
Weight: 0.03kg
Colour: Grey
Dimensions: L: n/a W: n/a H: n/a
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